Abstract
Doped with silicon or zinc, 3 inch D-shaped GaAs crystals were grown by the modified two-temperature horizontal Bridgman (M2T-HB) technique. Then (1&10) wafers were sliced axially from the chunk of silicon-doped 3 inch GaAs crystals and chemically etched to reveal the growth striations of solid/liquid interfaces. Three-dimensional, numerical simulations of the solidification process for growing 3 inch crystals by the M2T-HB system were performed and compared with the etched (110) wafers from experiments. The heat- and mass-transfer mechanism through the melt is the combination of convection, conduction and radiation. The finite volume approach and the continuum model are employed to determine the position and shape of the interface of the solid/melt, dopant concentration and the temperature field in the crystal and melt. Two methods for computing the dopant concentration are (a) solving the transport equation of full mass concentration and (b) using the simplified model of equilibrium. The computed solidification fronts and the dopant distributions agree successfully with the experimental data, and the axial distribution of dopant concentration as well as flow and temperature fields are computed for information of the crystal quality.
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Schedule a callMore From: Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science
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