Abstract

We developed focused ion beam direct deposition as a new method for fabricating patterned metal films directly on substrates. We designed and constructed a focused ion beam apparatus which satisfied demanded capabilities for direct deposition such as low energy and fine focused beam, high beam current density, high vacuum condition, changeability of ion species, precise and wide range patterning, sample observation by an optical microscope, and quick sample exchange. We also developed liquid alloy–metal ion sources for conductive materials, superconductive material and magnetic material. We tried to apply the focused ion beam direct deposition method to IC modification, surface acoustic wave (SAW) devices, SQUIDs, multilayers, and probing on small crystals. In SAW devices, SQUIDs, and multilayers, fabricated devices had comparable performance to devices fabricated by ordinary photolithographic processes. In IC modification and probing on small crystals, a low resistant and flexible connection was confirmed. We proved that focused ion beam direct deposition method is a useful tool for research and development such as prototyping.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.