Focus on software and semiconductor equipment

Abstract

Modeling and simulation softwareSection:ChooseTop of pageModeling and simulation s... <<Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Comsol has released version 5.1 of its Multiphysics software, which allows users to create models, build simulation apps, and share the apps via the Comsol server mode. Upgrades include full integration between the model builder and the application builder. Users can easily switch between them and update the model and the app simultaneously. The model builder’s functions and features can be used in the application builder with no need to interface between the software packages. Both models and apps can be saved in the unified .mph file format. Version 5.1 simplifies code generation and provides many template codes for users who want to implement highly customized commands and operations. Additions have also been made to add-on products that expand the simulation platform for electrical, mechanical, fluid flow, and chemical applications. Comsol Inc, 1 New England Executive Park, Burlington, MA 01803, http://www.comsol.comMagnetocaloric effect measurement softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea... <<Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...A software analysis program from Lake Shore Cryotronics allows users in the magnetic research field to characterize and determine the nature of magnetic phase transitions in magnetocaloric effect (MCE) candidate materials. It is offered in a free beta trial version for users of Lake Shore’s 7400 or 7300 series vibrating sample magnetometers (VSMs). According to the company, the software simplifies the process of calculating MCEs and makes it easier to prepare the measuring protocol. The program imports measured isothermal M(H) and isofield M(T) magnetization curves recorded using Lake Shore VSM system data acquisition software. It uses those data to calculate the materials’ refrigerant capacity and their magnetic entropy change from peak value and full width at half maximum. Lake Shore Cryotronics Inc, 575 McCorkle Boulevard, Westerville, OH 43082, http://www.lakeshore.comSemiconductor processing failure analysisSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ... <<Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Park Systems has released the NX-Hivac atomic force microscope system for research and industrial failure analysis in highly doped semiconductor processing. It uses high-vacuum scanning spreading resistance microscopy to enable higher sensitivity and resolution than can be achieved in ambient conditions. The applied force between tip and sample under ambient or dry nitrogen conditions is four times higher than in a vacuum; the lower force under vacuum reduces the strain in thin films of target samples, which results in higher spatial resolution and longer tip life. The NX-Hivac can load up to five samples and measure a seven-decade dynamic range of dopant concentration. It has a closed-loop XY scanner for accurate zoom-in imaging and a low noise ratio of 0.30 Å. Motorized laser alignment and high-resolution axis optics enhance ease of use. Park Systems Inc, 3040 Olcott Street, Santa Clara, CA 95054, http://www.parkafm.comComputing and modeling softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so... <<Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...MathWorks has released version 2015a of its Matlab mathematical computing software and Simulink graphical environment for simulation and model-based design. Enhancements include new graphical controls and displays and antenna-to-bits simulation and testing of wireless communications and radar systems. It also has four new products: an antenna toolbox for designing, analyzing, and visualizing antenna elements and arrays; a robotics system toolbox for designing and testing algorithms for robotics applications; a Simulink test for creating test harnesses, authoring complex test sequences, and managing simulation-based tests; and a vision HDL toolbox with pixel-streaming algorithms for designing and implementing vision systems on field-programmable gate arrays and application-specific integrated circuits for image processing, video, and computer vision systems. The MathWorks Inc, 3 Apple Hill Drive, Natick, MA 01760-2098, http://www.mathworks.comOptical engineering softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw... <<Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Photon Engineering has introduced version 14.40 of its optical engineering software, FRED. Used in product development, it merges optical elements with mechanical components to build integrated models. Among its improvements is increased flexibility in the feature that allows objects to be isolated in 3D view, since property-based isolation is now allowed. A new multiple selection method lets users simultaneously assign multiple properties such as coatings, ray-trace controls, and materials to different nodes in an object tree. Keywords, a new property in FRED, can facilitate complex model construction and configuration by acting as pass-throughs for objects assigned to them. A complete list of new FRED 14.40 features can be found in the developer release notes, accessible from the Help menu after installation. Photon Engineering LLC, 310 South Williams Boulevard, Suite 222, Tucson, AZ 85711, http://photonengr.comSemiconductor measurement toolSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement... <<Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Craic Technologies has developed its 20/30 XL microspectrophotometer to nondestructively analyze microscopic samples or microscopic areas on large devices, such as small-spot film thickness on 300-mm wafers. The instrument can acquire data by absorbance, reflectance, or luminescence spectroscopy. It can be used for UV-visible or near-IR microscopy and for high-resolution digital imaging of semiconductor and other types of samples. Users can add the company’s Apollo Raman spectroscopy modules to acquire Raman microspectra. Featuring calibrated variable apertures and manual and automated operation, the flexible instrument is designed to attach to large frames that can accommodate large-scale samples. Applications include mapping thin-film thickness of large devices, locating and identifying contaminants, and measuring strain in silicon. Craic Technologies Inc, 948 North Amelia Avenue, San Dimas, CA 91773, http://www.microspectra.comAutomated wafer-level device characterizationSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev... <<Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...Keysight Technologies has unveiled WaferPro Express 2015, a software platform for high-volume measurement of wafer-level devices and circuit components for R&D applications such as device modeling, process monitoring, and component characterization. By controlling all components—instruments and wafer probers alike—WaferPro Express reduces setup complexity and provides a unified platform for efficient automated measurement and data management. It is integrated with Cascade Microtech’s Velox 2.0 probe station control software, a combination which allows for complete wafer-map synchronization. That enables easy, error-free information exchange between the software, including wafer alignment, sites, and die information. To maximize efficiency during RF measurement, WaferPro Express periodically monitors the stability of the RF calibration. Keysight Technologies Inc, 1400 Fountaingrove Parkway, Santa Rosa, CA 95403-1738, http://www.keysight.comIntegrated circuit patterning metrologySection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter... <<Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s...The Archer 500LCM and SpectraFilm LD10, two advanced metrology systems from KLA-Tencor Corp, support the development and production of integrated circuit devices that are 16 nm and smaller. They are part of the company’s 5D patterning control solution that characterizes and monitors fab-wide processes. The Archer 500LCM system provides accurate overlay error feedback through all stages of the yield ramp, so chipmakers can resolve overlay issues associated with novel patterning techniques such as multipatterning and spacer pitch splitting. Through reliable, precise measurement of film thickness and stress, the SpectraFilm LD10 enables qualification and monitoring of the films and film stacks used in fabrication of FinFETs, 3D NAND, and other devices. KLA-Tencor Corporation, 1 Technology Drive, Milpitas, CA 95035, http://www.kla-tencor.comFluorescence imaging analysis softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal... <<Optical imaging and spect...Solder paste technologyAtomic layer deposition s...PicoQuant has released version 2.0 of its SymPhoTime 64 fluorescence-lifetime imaging microscopy (FLIM) and fluorescence correlation spectroscopy (FCS) software package. It provides new features for time-resolved data acquisition and analysis and for superresolution. They include global analysis of FCS and time-correlated single-photon counting (TCSPC) curve fitting, which improve cell measurements, and stimulated emission depletion data acquisition and analysis procedures, such as gated STED. An extended TCSPC binning functionality permits faster analysis and binary export of FLIM images. A newly developed fast pattern-matching approach allows two species to be separated by lifetime and absorption and emission spectra, thereby refining FLIM image analysis. PicoQuant, Rudower Chaussee 29, 12489 Berlin, Germany, http://www.picoquant.comOptical imaging and spectroscopy softwareSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect... <<Solder paste technologyAtomic layer deposition s...Advancements in LightField version 5.0, an upgrade of Princeton Instruments’ scientific imaging and spectroscopy software, include a math engine for analyzing 64-bit data in real time, an interactive virtual optical bench for managing multiple experiment setups, and automatic export of data in various formats. LightField supports the latest Princeton Instruments hardware, including IntelliCal spectral-calibration light sources. When paired with LightField’s automated point- by-point wavelength and intensity calibration, IntelliCal improves wavelength accuracy and NIST-traceable, instrument-independent intensity data by a factor of 10. For time-resolved imaging and spectroscopy applications, LightField provides users with an intuitive oscilloscope-like timing interface to PI-MAX4 ICCD cameras for easy synchronization and gating controls. Princeton Instruments, 3660 Quakerbridge Road, Trenton, NJ 08619, http://www.princetoninstruments.comSolder paste technologySection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technology <<Atomic layer deposition s...Indium Corporation offers its BiAgX solder paste as a drop-in replacement for the high-lead solders used in many high-reliability die-attach and electronics assembly applications. Made with the company’s high-melting solder paste technology, it can survive both high-temperature environments in excess of 175 °C with little degradation of the mechanical structure or other properties and J-STD-020 moisture sensitivity level reflow profiles up to 260 °C in the final solder joint. It does not contain lead, antimony, or specialty materials such as nanosilver or sintering aids. BiAgX reflows, solders, wets, and solidifies like any other solder paste. Available in both dispense and printing forms, it is suitable for small, low-voltage quad-flat no-lead packages used in portable electronics, automotive electronics, and industrial applications. Indium Corporation, 34 Robinson Road, Clinton, NY 13323, http://www.indium.comAtomic layer deposition systemSection:ChooseTop of pageModeling and simulation s...Magnetocaloric effect mea...Semiconductor processing ...Computing and modeling so...Optical engineering softw...Semiconductor measurement...Automated wafer-level dev...Integrated circuit patter...Fluorescence imaging anal...Optical imaging and spect...Solder paste technologyAtomic layer deposition s... <<The Savannah G2 atomic layer deposition (ALD) system from Ultratech Cambridge NanoTech incorporates advanced field-upgradable options that help researchers expand and characterize their portfolio of ALD films. One option is a low-vapor precursor delivery system that enables the growth of novel materials, including single- and multicomponent films from perovskite, yttrium, lithium, and the rare-earth families. Others include ellipsometry, quartz crystal microbalance, and mass spectrometry, which allow for the simultaneous growth of ALD films and the real-time characterization of the deposition process, important capabilities for thin-film R&D. Ultratech Cambridge NanoTech, 130 Turner Street, Building 2, Waltham, MA 02453, http://www.ultratech.com© 2015 American Institute of Physics.