Abstract
Abstract Grain-boundary flux pinning has been measured at 4·2 K and below in thin (0·04 to 2·6 μm thick) polycrystalline films of Pb—18% Bi alloy (k ≃ 7). Specimen geometry and grain alignment allow an easy separation of surface flux pinning and grain-boundary flux pinning. Measurements over a range of grain sizes (0·4 to 2·6 μm) indicate a specific flux pinning strength per effective grain-boundary area (2Q GB) of roughly 40 N m−2. This is of the order of magnitude predicted by the ‘electron scattering flux pinning’ (ESFP) model of Yetter, Thomas and Kramer (1982). Grain-boundary flux pinning in these films fails to scale with temperature.
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