Abstract

There is a growing interest in the fluorinization of resist materials in improving pattern formation efficiency for extreme ultraviolet (EUV) lithography. The increased polymer absorption coefficient obtained through this resist platform is expected to enhance acid production and in effect improve pattern formation efficiency. Based on this, a EUV resist which was synthesized by co-polymerizing tetrafluoroethelyne (TFE) and functional norbornene derivative was investigated. Relatively high sensitivity of 6.3 mJ·cm-2 for half-pitch (hp) 45 nm and satisfactory resolution limit of hp 40 nm was achieved. However, at present, line width roughness (LWR) was measured at comparatively large values of more than 8.4 nm at hp 45 nm. Further material and process optimizations may be necessary to improve its present lithographic capability. However, these initial results have shown the potential of fluorinated-polymer based platform as a possible solution for high sensitivity, high resolution and low LWR EUV resists.

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