Abstract
With the rapid development of 5G communications, the traditional interlayer dielectric material polyimide (PI) requires modification due to its intrinsically high dielectric constant (Dk), high dielectric loss (Df), and high moisture absorption, which make it difficult to meet the needs of the high-frequency communications industry. In this paper, a new strategy for the preparation of novel PI with intrinsically low Dk and Df is proposed from the perspective of molecular structure design, the modification effect of superimposing bulky triphenyl pyridine structures and strong electronegativity groups, combined with long-chain anhydride to reduce the density of the imide structure. Therefore, three bulk diamine monomers (BPAB, PBAB3F, PBAB6F) containing triphenyl pyridine structures were designed in this paper and polymerized with 4,4′-(4,4′-isopropyldiphenoxy) phthalic anhydride (BPADA) to obtain three new PIs (PI-H, PI-CF3, PI-2CF3) with different fluorine contents, focusing on the relationship between structure and properties, especially the effect of fluorine content on dielectric properties. The results of the study show that the dielectric and hygroscopic properties of PI improve with increasing fluorine content. Among them, PI-2CF3 has the best overall performance, showing low dielectric (Dk = 2.72@10 GHz & Df = 0.00233@10 GHz), high transparency (Cut-off wavelength (λ0) = 389 nm, Maximum transmittance (Tvia) = 89%) and low hygroscopicity (Water absorption (Ma) = 0.246%, Contact angle (Ca) = 111°).
Published Version
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call