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Abstract
Solder paste is used for reflow soldering of Surface Mount Devices (SMDs). In this paper we discuss how the various stages of the stencil printing cycle affect the rheological properties of the solder paste. First the heat generated in the paste roll is examined to see what effect it has on solder paste rheology, then we analyse in detail the process of paste withdrawal from a metal mask stencil and discuss those properties of solder paste that lead to a good print in terms of the size and shape of the solder paste particles, and their packing. In order to do this, we review some of the experiments and phenomena that have been shown to occur in dense suspensions, and see what aspects of that work are applicable to solder paste printing.
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Schedule a callMore From: Journal of Materials Science: Materials in Electronics
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