Flip chip method in smart card/smart label packaging

Abstract

Smart card has been used widely in telecom, finance, communication, society assurance, bank public security and other fields due to it's properties of international standard, intelligent and safety. It is no doubt that China will come to be the biggest application market of smart card soon in the world and there is great potential for the development of smart card industry. For example, more and more slim and thin smart cards with low cost, high reliability will be used in national public construction fields. Flip chip technology can meet some key points of the requirements. However, due to the temperature limitation of the manufacture process, the traditional flip chip technologies are not feasible at all to be used in the packaging of contactless smart cards even though low cost, high density and high reliability are the advantages of flip chip process. In this thesis, the interconnection medium, ACP (Anisotropic Conductive Film), ACF (Anisotropic Conductive Paste) and NCP (Non Conductive Paste) were used creatively as the interconnection medium to complete the flip chip process successfully in contactless card manufacturing. So less working procedures are necessary for smart card packaging. What is more. the following technical difficulties such as direct lamination on bare chip have been overcome. The new flip chip process was introduced in detail in the present work The products of this new process can be used as single way ticket of track communication, electronic ticket of sight seeing sites, etc.. This technology can also be applied in the manufacturing of the smart label which will be used widely in future.