Flexural vibration suppression behavior of sleeved phononic crystal pipes in thermal environment

Abstract

Design idea of phononic crystal has been introduced into vibration suppression of pipes and presents expected effects. During service period, thermal environment is a common factor that may change the dynamic behavior of system. In this work, thermal influences on wave attenuation effect are studied for the single-component PC pipe which is constructed by attaching sleeves to the original bare pipe. Under the preloading effect of thermal stresses, flexural wave bandgap shifts toward the lower frequency range with temperature increment. Bandwidth gets wider for pipes with sleeves of a relative length larger than 0.5, while the bandgap narrows down or even closes up for pipes with shorter sleeves. The opposite variation trends are caused by the reversal of edge modes and the unequal responses of the two edge frequencies to thermal stress stiffness. Deeper reason is the discrepancy in determining factor for frequency between the two edge modes. As a result, the two edge frequency loci drop asynchronously under thermal load, and the transition point of bandgap shifts leftward. A thermo-vibrational joint test system is constructed and flexural wave transmittance is measured, for the first time, for a heated PC pipe. Experimental phenomena and simulation results suggest that the initial deflection and non-ideal constraint of the specimen make the attenuation band present opposite variation trends compared to the ideal model. The former strengthens the stiffness of the PC pipe, and the latter weakens the thermal influence on the PC pipe. Both the two non-ideal factors have a more significant impact on starting frequency of the attenuation band due to the difference in sensitivity of bandgap edge frequencies to stiffness perturbation of the PC pipe.