Abstract
A system has been designed for the characterizing of both low and high Tc junctions and devices. Fully automated measurements of resistance versus temperature, current versus voltage, and critical current versus applied field can be carried out on up to eight devices in one cooldown cycle. The system has been proven to reduce the repetitive nature and time involved in characterizing many junctions and devices, and greatly speeds up the analysis of changes in their parameters. Connections are made to the sample using spring contacts which eliminate the need for soldering to contact pads. One or two substrates with ten connections per substrate can be placed in the probe at the one time. A microcomputer with an IEEE488 interface, four standard instruments (two constant current sources, one digital multimeter, and one voltmeter), and a specially designed probe and software has been incorporated to provide a system which is very flexible and yet very simple to operate.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
