Flash DSC characterization of thermal contact resistance and cross-plane thermal conductivity of micrometer-thin films

Abstract

Thermal contact resistance of thin film materials is an important issue in the heat management of highly integrated microelectronic systems. We proposed a strategy of Flash DSC measurement to characterize simultaneously thermal contact resistance and cross-plane thermal conductivity of Nylon 66 thin films with three thicknesses. We obtained the thermal contact resistance 1.317 × 10−5 m2 K/W at the interface between the sensor and the thin films, which showed as high as 30% in the total thermal resistance of 10 μm thickness thin films. The cross-plane thermal conductivity 0.32 W/(m K) becomes slightly larger than our previous result 0.25 W/(m K), owing to the elimination of thermal contact resistance. Our steady-state measurement could be complemental to ASTM 5470 for the measurement of thermal contact resistance and thermal conductivity in the micrometer scale.