Measurement of thermal conductivity and contact resistance of paper and thin-film materials

Abstract

A new thermal conductivity cell is described which can be used to measure the bulk thermal conductivity and the thermal contact resistance of paper and other thin-film materials. The cell incorporates a hydraulic piston which can apply pressures up to 1700 psi to the sample which is situated between the optically flat end faces of two brass columns. By measuring the thermal resistance of paper samples of various thicknesses, it is demonstrated that a pressure of 1700 psi effectively eliminates the thermal contact resistance. By comparing measurements at zero and maximum applied pressure, both the bulk conductivity and the contact resistance can be calculated. This is illustrated with several types of paper. In all cases, there is a qualitative correlation between the measured contact resistance and the surface roughness of the sheet. The technique can also be used for thin polymer films, and for layered structures such as the ink donor films used in thermal transfer printing.