Abstract
Due to the prevalent randomness and uncertainties associated with traditional loose polishing, fixed abrasive polishing in an anhydrous environment has been chosen as a new polishing method. In this paper, cerium oxide is the main component for polishing pellets, and the particle size distribution of cerium oxide is measured. A material removal model for fixed abrasive polishing of fused silica in an anhydrous environment is proposed. Based on this model, we simulate the roughness of fused silica in fixed abrasive polishing process by using a Monte Carlo method with a constant removal mechanism and obtain the percentage of plastic and chemical removal. The percentage result is then taken into the material removal equation to calculate the material removal rate. The final convergence value of the roughness with 2 μm particle size is about 1.8 nm, while the final convergence value of the surface roughness of the workpiece by Monte Carlo simulation is about 1 nm. The experimental material removal rate at 2 μm particle size is 5.48 μm/h, while the simulation result is 4.29 μm/h. The experiment data of roughness and material removal rate all verify the model.
Highlights
With its excellent physical and chemical properties, fused silica is applied in a wide range of scientific and industrial applications, for example in chip shielding, as well as in lenses and phase plates in lasers
Conventional polishing uses rare earth or metal oxides, which are less hard than glass, mixed with deionized water and other chemical additives, to obtain a non-damaged glass surface utilizing a mechanochemical removal mechanism for material removal
The material removal rate in loose abrasive polishing is influenced by several factors, including the nature of the polishing pad, the nature of the polishing solution, and the particle size distribution, which make it difficult to establish an accurate material removal model for loose abrasive polishing
Summary
With its excellent physical and chemical properties, fused silica is applied in a wide range of scientific and industrial applications, for example in chip shielding, as well as in lenses and phase plates in lasers. Each of these different systems places very stringent demands on the surface quality of the fused silica. Fused silica is a hard and brittle material and is usually machined with both conventional grinding and polishing methods. Conventional polishing (e.g., loose polishing) uses rare earth or metal oxides, which are less hard than glass, mixed with deionized water and other chemical additives, to obtain a non-damaged glass surface utilizing a mechanochemical removal mechanism for material removal. The removal rate of traditional polishing materials is only 3–6 μm/h [1,2,3]
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