Characteristic of fixed abrasive polishing for fused silica in anhydrous environment

Abstract

In order to overcome the randomness of free abrasive polishing (CMP), abrasive waste and the resulting hydration layer, this paper presents a fixed abrasive polishing technique in the anhydrous environment. We have achieved a stable polishing wheel sintering process. The pellet we made have applied to fused silica polishing.It is found that the surface profile accuracy and roughness convergence speed are significantly improved comparing with the free abrasive polishing, and the pellet did not break and wears evenly. The influences of changing parameters including pressure, rotation speed on the material removal rate and surface roughness is examined. Removal rate does not increase with applied pressure and rotation speed, which is inconsistent with Preston's formula. The heat generated in machine process is paramount parameters determining removal efficiency. In order to get the most suitable processing temperature, We employed in-situ infrared camera and finite element analysis to test the temperature, which clarify the material removal does not increase with applied pressure and rotation speed in dry fixed abrasive polishing. Further, for testing the properties and stability of the pellet, the chips and polishing wheel were chemical analyzed using EDS and XRD, the results show a probable mechanism.