First Order Deign by Integration of Analysis and Optimization Method (1st Report, First Order Analysis by Focusing to the Boundary Conditions at Dividing the Module)

Abstract

Until now, the analysis method and the optimization method, which were used in design, were evolving independently. However, when designed combining them, coexistence of time and precision was difficult. Then, we aimed at constructing the high-speed first order design method by the modularizing model and integration of first order analysis and optimization method based on boundary conditions between modules as the dynamic behavior of the design object. In this report, we proposed the framework of the first order analysis method based on boundary conditions between modules and applied this framework to thermal analysis of an electronic circuit board, and this thermal analysis method was analyzable at high speed (analysis time under 1 ms on four device modules on circuit board) with maintaining precision to the analysis by FEM, were shown clearly as the first report.