Abstract
A new approach to charge-coupled device (CCD)-based time-delay-and-integration (TDI) imaging is presented that implements the CCD TDI pixels together with advanced CMOS drivers and readout in one single chip. This CCD-in-CMOS technology is compatible with backside illumination for enhanced sensitivity, and multispectral filters can be added for increased imaging performance. With this highly sensitive and high-speed imaging solution, high-end applications such as remote sensing, life sciences and machine vision are targeted.
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