Abstract
ABSTRACTThis study aims to investigate the influence of a conveyor angle on capillary flow during the wave soldering process. Finite volume-based simulation is utilized to study the capillary flow of molten solder. Molten solder filling through capillary action of a pin-through-hole (PTH) is considered at different conveyor angles (i.e., 0–10°). Two PTH positions, namely, center (r/R = 0.2) and offset (r/R = 0.6), are investigated. The effects of a conveyor angle on molten solder filling volume, time, pressure profile, and velocity vector are numerically analyzed.
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