Abstract

The present work deals with the mechanical behaviour of thin films bonded to a homogeneous elastic orthotropic half plane under plain strain condition and infinitesimal strain. Both the film and semi-infinite substrate display linear elastic orthotropic behaviour. By assuming perfect adhesion between film and half plane together with membrane behaviour of the film, the compatibility condition between the coating and substrate leads to a singular integral equation with Cauchy kernel. Such an equation is straightforwardly solved by expanding the unknown interfacial stress in series of Chebyshev polynomials displaying square-root singularity at the film edges. This approach allows handling the singular behaviour of the shear stress and, in turn, reducing the problem to a linear algebraic system of infinite terms. Results are found for two loading cases, with particular reference to concentrated axial forces acting at the edges of the film. The corresponding mode II stress intensity factor has been assessed, thus providing the stress concentrations at both ends of the covering. Possible applications of the results here obtained range from MEMS, NEMS, and solar Silicon cell for energy harvesting to welded joint and building foundation.

Highlights

  • A wide class of MEMS and NEMS are based on thin films and coatings technology and the most part of these microdevices involves film and substrate materials which exhibit anisotropic behaviour [1]

  • The present study investigates the mechanical interaction between a thin elastic film and an elastic orthotropic half plane under various loading conditions

  • The contact problem of a homogeneous orthotropic half plane covered by thin film has been analysed here

Read more

Summary

Introduction

A wide class of MEMS and NEMS are based on thin films and coatings technology and the most part of these microdevices involves film and substrate materials which exhibit anisotropic behaviour [1]. Thin films and coatings bonded to an elastic substrate generate geometric discontinuities and, in turn, stress concentrations and strain localizations which can drive damaging phenomena like delamination and crack growth. These phenomena can be properly modeled in the framework of both infinitesimal [16, 17] and finite elastostatics [18,19,20,21,22]. The present study investigates the mechanical interaction between a thin elastic film and an elastic orthotropic half plane under various loading conditions. The strain compatibility condition between the film and the underlying substrate leads to a singular integral equation with Cauchy kernel.

Half Plane Covered by Thin Film
Influence of the Parameter γ
Results and Discussion
Conclusions
Elastic Parameters
Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call