Abstract
Thermal analysis was required in order to aid in the design and testing of a radiation tolerant computing (RTC) system using a radiation sensor. During development of the system, different test beds were employed in order to characterize the radiation sensor and its supporting electronic systems. The most common preliminary tests are high altitude balloon tests which allow the sensor to experience cosmic radiation at high altitudes, consistent with space flight operations. In this study, finite element analysis (FEA) was used to evaluate primary system architecture, system support structures, and the flight payload in order to determine if the system would survive preliminary and future testing. ANSYS FEA software was used to create thermal models which accurately simulated convective cooling, system heat generation, and solar radiation loading on the exterior of the payload. The results of the models were then used to optimize payload PC board (PCB) design to ensure that the internal electronic systems would be within acceptable operating temperatures.
Highlights
Cosmic radiation has several detrimental effects on digital integrated circuits used in space electronics
The steady state temperature distribution, in Kelvin, can be seen in Figures 10 and 11 for the entire structure, for the field programmable gate array (FPGA) board and aluminum support bushings, respectively. It is clear from the temperature contour plots that the maximum temperature of 322.2 K or 49∘C was attained in the FPGA board during the long high altitude float of the payload that is within the acceptable temperature range for FPGA
The thermal finite element analysis (FEA) models used in this study were very useful in predicting accurate maximum temperature results for the high altitude test flights
Summary
Cosmic radiation has several detrimental effects on digital integrated circuits used in space electronics. The first type of balloon test was the Balloon Outreach, Research, Exploration, and Landscape Imaging System (BOREALIS) test sponsored by the Montana Space Grant Consortium (MSGC) This test consisted of a large atmospheric weather balloon that carried a string of test payloads up to an altitude of just below 100,000 feet. To aid in test payload design, multiple finite element analysis (FEA) simulations were performed to help ensure that the RTC system would not thermally fail during the first flight. The payload was flown in a high altitude balloon and FPGA package temperature was recorded during the flight This test data was used to verify the finite element model developed to simulate heat transfer between the FPGA board and surrounding package materials and environment. The results obtained from the parametric FEA study will give guidelines to future engineers regarding the design of PC boards for application in space electronics
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