Finite element analysis of multi-wire saw silicon rods with consolidated abrasive diamonds

Abstract

A cutting model is presented in the paper for multi-wire saw silicon rods with consolidated abrasive diamonds. The stress of single diamond particles is analyzed. Besides, the calculation formula of normal and tangential cutting force is found out by formula derivation and calculation. The paper uses ANSYS 15.0 to make finite element analysis for multi-wire saw silicon rods with consolidated abrasive diamonds by loading different process parameters, including wire-line speed and feeding force. Meanwhile, according to removing mechanism of brittle materials, when the maximum cutting depth of single abrasive diamond silicon is less than the critical cutting thickness, the cutting way of multi-wire saw silicon rods is plastic removal. Comparing the deformation by finite element analysis with the maximum cutting depth, the error is not more than 15 %. So the cutting model and calculation of cutting force of multi-wire saw silicon rods with consolidated abrasive diamonds are proven to be basically consistent. The results indicate that when the wire-line speed is constant, with the increase of the feeding force, the maximum cutting depth is also increased, and with the feeding force is constant, with the increase of the wire-line speed, the maximum cutting depth increases first and then decreases. Therefore, considering the maximum cutting depth, setting the wire-line speed to 900 m/min and the feed force to 725 N is the best cutting process parameters.