Abstract
Purpose – To provide an approach to fleXBGA design and reliability analysis.Design/methodology/approach – A two‐dimensional (2D) plane strain finite element analysis model is established to simulate the thermo‐mechanical behaviour of fleXBGAs which are subjected to thermo‐cyclic loading under different temperature cycling conditions. The model has been used to consider the effects of printed circuit board (PCB) thickness, die size, package size, ball count, pitch and substrate configuration. The Anand constitutive model is adopted to simulate creep and plastic deformation of the solder joints. A fatigue life prediction model based on plastic shear strain range is then applied to predict the fatigue life of different kinds of fleXBGA.Findings – Comparison of fatigue life predictions and experiments show that the maximum prediction errors are mostly within ±50 per cent, and it can be concluded that a smaller die size, a thinner PCB, a smaller solder ball diameter, more balls, a smaller temperature range and...
Published Version
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