Abstract
Screen printing is one of key processes in manufacturing crystalline silicon solar cells. The performance of screen printing process is characterized by various types of variables. The effects of squeegee pressure, angle and speed, and snap-off on the stress distributions of silicon wafers are focused. The breakage rate is evaluated by using the stress level during the screen printing process. A finite element analysis is performed according to Taguchi design of experiments in this study. The factors with the most effect on wafer quality and productivity are analyzed and optimal screen printing conditions were selected for a lower breakage rate.
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