Abstract
Transient currents created by on-chip switching in cores and by off-chip drivers cause noise to be generated on package parasitics. Simple mathematical models for the noise are used to derive figures-of-merit for the two cases of on-chip and off-chip switching. SIA Roadmap packaging trends are used with the figures-of-merit to produce package noise trends.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callMore From: IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
