Abstract
The present study is a focused and comprehensive analysis of the dielectric and thermal properties of twenty-four 3D printed polymers suitable for fused filament fabrication (FFF) in electronic applications. The selected polymers include various thermoplastic elastomers, such as thermoplastics based on polycarbonate (PC), polyethylene terephthalate glycol (PETG), and acrylonitrile butadiene styrene (ABS-T). Their overall thermal behavior, including oxidation stability, glass transition, and melting temperature, was explored using simultaneous thermal analysis (STA) and differential scanning calorimetry (DSC). Considering their intended usage in electronic applications, the dielectric strength (Ep) and surface/volume resistivity (ρs/ρv) were comprehensively tested according to IEC 60243-1 and IEC 62631-3, respectively. The values of the dielectric constant (ε’) and loss factor (ε”) were also determined by broadband dielectric spectroscopy (BDS). While, on the one hand, exceptional dielectric properties were observed for some thermoplastic elastomers, the materials based on PCs, on the other hand, stood out from the others due to their high oxidation stability and above average dielectric properties. The low-cost materials based on PETG or ABS-T did not achieve thermal properties similar to those of the other tested polymers; nevertheless, considering the very reasonable price of these polymers, the obtained dielectric properties are promising for undemanding electronic applications.
Highlights
The 3D printing of polymer materials is currently a widely used additive technology, especially in rapid prototyping
Fused filament fabrication (FFF) can be used in several processes, e.g., for (i) the encapsulation of surface mount devices (SMDs) or printed circuit boards (PCBs) on textile substrates by the thermocompression method [2]; (ii) structural electronics [3,4]; (iii) devices used in explosive atmospheres [5]; (iv) high-frequency electronic applications, in which wireless communication and data transmission are used [6,7]; or (v) power electronics [8]
For the reasons mentioned above, this study addresses the complex characterization of a wide range of 3D filaments for FFF printing technology with intended usage in electronic applications
Summary
The 3D printing of polymer materials is currently a widely used additive technology, especially in rapid prototyping. The dielectric parameters (Ep, relative permittivity, dielectric losses, ρs, and ρv) were measured since they are crucial to the reliability of many electronic devices, especially in such applications where (i) wireless communication and data transmission are used [31]; (ii) the structures are in direct contact with high-frequency electrical circuits [32]; or (iii) power electronics are the final product [8] Thermal parameters, such as the glass transition temperature (Tg); the melting temperature (Tm); and the temperature of the first oxidation (Tox), were measured because electronic circuits containing 3D printed parts can be exposed to high temperatures or generate heat themselves. This and other emerging applications of FFF 3D printing for electronics is briefly outlined in the following paragraph
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