Ferroelectric passivation layer derived high performance AlGaN/GaN heterojunction field-effect transistor

Abstract

The density of interface states is strongly related to the performance of AlGaN/GaN high-electron-mobility transistors (HEMTs) and is normally attributed to the degradation of the carrier mobility and gate leakage current. The density of interface states is optimized in conventional AlGaN/GaN HEMTs through the use of different passivation layers. However, different passivation layers may create more complex interface structures. In our previous work, ferroelectric polarization was used to regulate the carrier concentration in AlGaN/GaN HEMTs. Herein, we propose a ferroelectric passivation-layer-induced pure field effect modulation within the AlGaN/GaN heterojunction field-effect transistors. After positive poling, the interface trap density (Dit) decreases by 71% and current collapse is reduced. The output current (IDS) increases from 408 to 462 mA/mm and transconductance (gm) increases from 88 to 149 mS/mm. Simultaneously, the carrier mobility in the channel is also greatly improved after positive poling. When negative poling is applied, the gate leakage decreases and the breakdown voltage of the device increases by 55%. Our work provides a simple and effective way to study the density of interface states in GaN device design and optimization.