Abstract
XY motion platform in flip chip machine plays a key module to achieve precise positioning in the process of flip chip packaging. The paper presents an XY motion platform structure. The static and modal characteristics of the XY motion platform were calculated by finite element method, and then some important conclusions were obtained. The displacement and stress distribution of XY motion platform were disclosed. The relevant change trends of displacement and stress under the different load were investigated and the first four natural vibration modes of the XY motion platform were obtained. In the experiment, the vibration behavior was measured by a non-contact laser measuring device. The experiments verify the correctness of the simulation of the XY motion platform. These results can help improve the reliability of the XY motion platform.
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