Abstract
Modification of polypyromellitimide with non-aqueous acid solutions based on molecular iodine and copper iodide helping to ensure semiconductor and catalytically active surface layers has been studied. Minimal disturbance of the valuable bulk dielectric properties is achieved at a high concentration of the surface carboxyl groups (10 × 10 −7 mole/cm 2). The chemical nature of the surface layers was studied by the methods of wettability, titrimetric analysis and reflective UV spectroscopy.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
