Abstract
Abstract The kirkendall void had been a well-known issue for long term reliability of semiconductor interconnects, while even the KVs existing at the interfaces of Cu & Sn, it may still be able to pass the condition of un-bias long term reliability testing, especially for 2,000 cycles of temperature cycling test and 2,000hrs of high temperature storage. A large numbers of KVs was observed after 200cycles of temperature cycling test at the intermetallic Cu3Sn layer which locate between the intermetallic Cu6Sn5 & Cu layers. These kinds of voids will growth proportional with the aging time at initial stage, but slowing down attribute to the barrier layer of Cu3Sn & Cu interfaces. This paper compare various IMC thickness as a function of stress test, the Cu3Sn & Cu6Sn5 do affected seriously by heat, but Ni3Sn4 is not affected by heat or moisture.
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