Fatigue reliability design for metal dual inline packages under random vibration based on response surface method

Abstract

With the diversity and complexity of application environment, electronic products always work under harsh random vibration conditions. Especially for metal Dual Inline Packages, the solder joints between printed circuit boards and devices in mechanical vibrations not only need to support great weights, but also require standing much stronger stresses because of the metal packaging materials. In this paper, fatigue reliability design for Metal Dual Inline Packages under random vibration was conducted based on finite element analysis, physics of failure model and surface response method. The modal analysis for a prototype of the printed circuit board was carried out by both simulations and experiments. Equivalent stress distributions of the validated model under random vibration during normal working were calculated as well as that of critical solder joint under the metal Dual Inline Package device. The workflows of fatigue lifecycle prediction and response surface method were established. Moreover, as a case study, fatigue reliability design for the metal Dual Inline Package device in the prototype PCB was implemented to optimize the design parameters and improve the fatigue lifecycle more than ten times by the proposed method.