Stress-Strain Analysis and Parameter Optimization of Sop Solder Joints under Random Vibration

Abstract

In this paper, we mainly focus on SOP solder joints as the research target, and use Ansys Workbench software to establish a finite element analysis model of SOP chips, using solder joint length, solder joint width, and solder joint height as design variables to perform finite element analysis of the modeled solder joints under the loading conditions of random vibration. Using the maximum stress and maximum strain of SOP solder joints as the target values, a three-factor, three-level experiment was established using Design-Expert software to analyze the stress-strain distribution of SOP solder joints under random vibration conditions, and the parameters were optimized using the response surface method and simulated. The results show that under the condition of random vibration, the maximum stress and maximum strain of SOP solder joints appear at the farthest distance from the center of the chip where the solder joints are bonded to the PCB, indicating that failure is most likely to occur at this location, and based on the response surface optimization method, the optimal combination of geometric parameters for solder joint length 0.85 mm, solder joint width 0.44 mm, and solder joint height 0.07 mm is obtained, and the optimal combination of solder joints Simulation analysis is performed to verify the optimal combination of solder joints. The results show that the maximum stress and maximum strain in the solder joints are reduced, which verifies the correctness of the optimization results.