Abstract
Fatigue crack closure and crack growth behaviour in Ti–2.5 wt % Cu alloy with two equiaxed and two lamellar microstructures have been investigated by constant-load amplitudetests. Plasticity-induced crack closure and roughness-induced crack closure have been characterized separately by experimental methods. A change in closure mechanism from plasticity-induced crack closure at high ΔK values (region of high stress intensity ranges)to roughness-induced crack closure at low ΔK values occurs in a solution-annealed equiaxed microstructure, while plasticity-induced crack closure is the operative closure mechanism in an over-aged equiaxed microstructure over the whole range of ΔK and roughness-induced crack closure occurs in two lamellar microstructures. The crack closing stress intensity factor for plasticity-induced crack closure increases continuously with increasing maximum stress intensity. The crack closing stress intensity factor for roughness-induced crack closure increases with increasing maximum stress intensity at low ΔK, and remains constant at high ΔK. Crack closure and crack path deflection have a significant influence on the crack growth rates. © 1998 Kluwer Academic Publishers
Published Version
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