Abstract
The stress and strain of Plastic Ball Grid Array (PBGA) is investigated for reliability evaluation, failure analysis, or manufacturing. A one-eighth model is built to estimate the thermal stress and strain of PBGA under thermal cycling temperature (0°C–100°C). The different 3D elements such as Visco107 and Solid45 were selected for modeling of material 37Sn63Pb and Print Circuit Board (PCB), silicon die, substrate, and Epoxy Molding Compound (EMC), respectively. The results show that the maximum equivalent stress and equivalent plastic strain occur in the second outer solder joint and close to the position of chip. The key solder joint can be obtained and the key node of solder joint is 41402. The results indicate that the integrating 3D model can provide a more comprehensive profile for the thermal investigation of the PBGA package than from using any 2D model. The investigation provides a basis for improving reliability of PBGA product in engineering design.
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