Abstract
Electrochemical alloying of Cu substrates with Sn through a reduction-diffusion method was investigated using an ionic liquid, 1-ethyl-3-methylimidazolium bis[(trifluoromethyl)sulfonyl]amide, as a solvent for an electrolytic bath. The use of the ionic liquid made it possible to raise the processing temperature up to 190 åC and form silver-gray Cu-Sn "speculum metal" layers faster than with an aliphatic quaternary ammonium-based ionic liquid, trimethyl-n-hexylammonium bis[(trifluoromethyl)sulfonyl]amide. The layers obtained at 170-190 åC showed clear composition gradients where the outer and inner parts of the Cu-Sn layer have compositions corresponding to Cu6Sn5 and Cu3Sn phases, respectively.
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