Abstract
Cu-Sn alloy metallization of a non-conductive epoxy substrate was demonstrated through successive electrochemical processes: (i) conventional electroless Cu deposition on the substrate and (ii) electrochemical alloying of the resulting Cu layer with Sn through a reduction-diffusion method using an ionic liquid bath at 150 åC. The resultant Cu-Sn alloy layer, composed of Cu6Sn5 and/or Cu3Sn intermetallic phases, was compact, smooth, and adhesive. Dependence of the intermetallic phases on applied potential and alloying time was also examined to discuss the alloy formation mechanism, demonstrating that Cu-Sn alloy layers composed of desired phases could easily be prepared by controlling these parameters.
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