Abstract

Glass is a very stable material at room temperature and has good resistance to gas, bacteria, and organisms. Due to the development of the electronic industry, the industrial demand for creating a conductive pattern on glass is increasing rapidly. To create conductive circuit patterns on the glass surface, non-contact methods based on high energy sources or chemical methods are generally used. However, these methods have disadvantages such as low conductivity, high cost, and size limitations. Processes such as LCLD (laser-induced chemical liquid phase deposition) have been widely studied to solve this problem. However, it has a fatal disadvantage of being slow. Therefore, in this study, various process changes were attempted to improve productivity and conductivity. In particular, sufficient thermal energy was supplied with high laser power for a stable chemical reduction, and the scanning path was changed in various shapes to minimize the ablation that occurs at this time. Through this, it was possible to disperse the overlapped laser energy of high power to widen the activation area of the reduction reaction. With this proposed LCLD process, it is possible to achieve good productivity and fabricate conductive circuit patterns faster than in previous studies.

Highlights

  • Glass is widely used in various fields because it is highly light-permeable and biochemically stable

  • Despite the many advantages of the laser-induced chemical liquid phase deposition (LCLD) process, since it is based on a chemical reduction reaction by local heating, it has a fatal disadvantage: the process speed is very slow

  • When the process speed was increased based on the horizontal line shape scan path, which was mainly used in previous studies, deposition was hardly performed due to insufficient time and thermal energy for a stable reduction reaction

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Summary

Introduction

Glass is widely used in various fields because it is highly light-permeable and biochemically stable. Due to the limitation of the paste material, adhesion to the smooth base material is low, and the formation of the conductive structure is limited in non-planar shapes For this reason, a lot of research has been conducted on selectively depositing a metal after fabricating a pattern on glass using a laser [7,8,9]. Various processing conditions based on a 1064 nm nanosecond NIR laser, which is easy to configure economical equipment, were tested to improve the productivity and durability of the existing LCLD process To this end, unlike previous studies, experiments were conducted based on high laser power, and various patterns were irradiated to minimize glass damage and to ensure sufficient chemical reactions. To observe the microstructure and elemental composition of the specimens, scanning electron microscopy (SEM, VEGA3 LM, TESCAN, Brno-Kohoutovice, Czech Republic) was used

Horizontal Line
Specific Resistance and Applications
Conclusions
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