Fast curing velocity, low volume shrinkage and high heat resistance achieved in novel ultraviolet curing adhesives

Abstract

Nowadays, Ultraviolet (UV) curing adhesives have been extensively researched in the fields of health care and electronic components thanks to their high curing rate, low energy loss, no solvent pollution and excellent properties. UV curing systems bearing modified acrylate prepolymers have been widely utilized in the field of electric industry packaging. The advantages are low cost, high reliability, quick curing velocity, high mechanical trait and strong solvent endurance. For further optimizing the curing rate, curing volume shrinkage and thermal resistance of UV curing adhesives, in present work, two kinds of novel UV curable adhesives bearing epoxy and polyurethane modified acrylate prepolymers were designed and fabricated. Adhesive properties and thermal resistance of two adhesives were studied firstly. Boiling and solvent tolerances as well as bin stability of adhesives were discussed. Finally, over-all performances of as-prepared adhesive and purchased commercial adhesive were compared. High curing rate, low curing volume shrinkage and high heat resistance were achieved. This work might offer a facile and practical route to prepare the high-performance UV curable adhesives with significantly improved over-all properties by formula design.