Abstract
Natural frequencies of passive radio frequency identification (RFID) tags were studied as they played a great role for their reliability. Both analytical and numerical predictions indicated that natural frequencies were in the kilohertz range; tags must not have been suffered resonance. But in reality, tags used to fail when subjected to low frequency vibrations. Anisotropic conductive adhesive (ACA), a commonly used bonding agent, was detected as the responsible item for these failures. A new bonding method has been put forward that would replace ACA by lead free S–Bond solder material to connect flip chip of an RFID tag to substrate antenna. Having better strength and adhesion characteristics, joints with S–Bond would provide improved bonding as established by analytical and numerical estimation and supported by experimentation.
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