Abstract
The failure behaviors of ball grid array (BGA) solder ball joints under the various loading speeds of the high-speed shear test were investigated both experimentally and with non-linear, 3-dimensional finite element modeling. Conventional Sn-37Pb and Pb-free, Sn-3.5Ag solder alloys were used to compare the failure behaviors. Far greater shear forces were measured by the high-speed shear test than by the low-speed shear test. The shear force further increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloys. Brittle interfacial fractures were more easily achieved by the high-speed shear test in the Sn-3.5Ag solder joints, especially at higher shear speed. This result was discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect, and the resulting stress concentration in the interfacial regions. However, no transition of the failure mode was observed in the high-speed shear test of the Sn-37Pb solder joints.
Published Version
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