Failure Analysis Technology of Lead-free BGA Solder Joints and Relevant Cases

Abstract

Ball grid array (BGA) is an interconnect technology that smaller package sizes and lower failure rate, which joints are hidden in the body of the device. It is hard to detect the solder joint defects and analyze the failure. How to effective judge the quality and reliability of BGA solder joints is a difficult problem in electronic manufacturing. In this paper the failure analysis process and methods on lead-free BGA solder joints are introduced mainly. Combined with the typical failure analysis case of lead-free BGA, these analysis technology is introduced in the application of actual case. The failure analysis techniques play an important role on promoting the reliability of lead-free BGA solder joints, which can quickly and accurately find the failure cause. It will lay the foundation for improving the quality of products.