Abstract
Scanning Super-conducting Quantum Interference Device (SQUID) Microscopy, also known as SSM, is a current density imaging technique that has been used in failure analysis to localize package- and die-level shorts. New developments have extended this technology to localizing resistive opens, augmenting other non-destructive failure analysis tools like TDR and assisting destructive deprocessing by further pin pointing defect locations. A new method to isolate resistive opens with Scanning SQUID microscopy will be presented in this paper, and demonstrated on actual resistive open yield failures in both wire-bond and flip-chip devices.
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