Abstract
Inherent toxicity makes lead a banned material in solder alloy making process. Lead-tin alloy was a favorable alloy used for soldering in electronic packaging manufacturers. As a result of the ban on lead, electronics package industries were looking for novel lead free alloys which can substitute the conventional Sn-Pb alloy. Many alloys were discovered by the scientists. None of them were able to substitute the Sn-Pb alloy and become the market leader. In this paper a new composition with Sn, Cu and Ni is made to analyze which can potentially replace the lead containing solder alloy. Using the design of experiments method, the optimized composition of Cu and Ni is predicted. The full factorial design of experiments with two replications is used to find the optimized composition. Melting temperature, contact angle and hardness were taken as the critical output parameters. Results obtained shows that the optimum composition of Cu and Ni are 1 and 1% by wt.
Highlights
IntroductionSoldering has varied application in the electronics package manufacturing industry
Soldering is a metallurgical joining method without melting the parent metals [1]
The experiment was run with two factors (F), which is Cu & Ni composition and two levels (L), which is 0.5% and 1% by wt. for Cu, 0.5% and 1% by wt. for Ni. 8 runs were conducted with 2 replications, as per the formula:(L)F, (2)2 = 4 Â 2 replications = 8
Summary
Soldering has varied application in the electronics package manufacturing industry. The solder gives electrical and mechanical continuity in the electronic packages [2]. Due to the inherent toxicity of the lead, it is banned from alloy making [1,2,3]. Various environmental legislations came to existence to ban lead in alloy making. Electronic industries shifted to lead free solder alloys. Need for new lead free alloys which can replace the Sn-Pb alloy aroused. Researchers around the world started searching for new lead free solder alloy. The desirable qualities of new alloys are low melting point, good hardness, low contact angle, low cost, availability etc. Many compositions were discovered as a replacement for Sn-Pb alloy. Some major compositions include Sn-BiAg [5], Sn-Bi [6], Sn-Zn [7], Sn-Ag-Cu [8,9], Sn-Cu [7], SnZn-Bi [5], Sn-Cu-Ni [10,11], Sn-Cu-Bi [12]
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