Abstract

Zinc oxide (ZnO) thin film transistors were fabricated by local anodic oxidation (LAO) of polycrystalline zinc film using an atomic force microscope (AFM). Nanometer-thin zinc film can be locally transformed into $p$-type zinc oxide by an anodic oxidation technique using an AFM at room temperature. With this fabrication process, we have fabricated a backgate, Schottky-barrier-contact type thin film ZnO transistor. This fabrication requires no semiconductor material to produce transistors, only conventional metal film. The fabrication creates active area and source/drain contacts through simple AFM oxidation, with no requirement for additional semiconductor thin film deposition and photolithography. A representative LAO thin film transistor fabricated in this study exhibited a field-effect mobility of $23.6\text{ }{\text{cm}}^{2}/\text{V}\text{ }\text{s}$, a peak transconductance of $15.8\text{ }\ensuremath{\mu}\text{S}$, and an ${I}_{\text{on}}/{I}_{\text{off}}$ ratio of ${10}^{6}$. To the best of our knowledge, the mobility value attained for this LAO thin film transistor is higher than that of any previously reported amorphous-silicon-based thin film transistors. Its peak transconductance and ${I}_{\text{on}}/{I}_{\text{off}}$ ratio are also enhanced compared with a backgate field-effect transistor with the same amorphous silicon channel as utilized in conventional thin film transistors.

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