Abstract
A tungsten/copper graded materials is developed as a new material against plasma, ion beams, electron beams, etc. The fabrication process of the tungsten/copper graded material is newly established by sintering and an infiltration technique. It is very useful for combining two materials with a considerable difference in melting point, such as a combination of tungsten and copper. In this paper, the process conditions for preparing the tungsten/copper graded material is established. The ability to reduce thermal stresses in the tungsten/copper graded material is confirmed by heat-cycle testing in comparison with a tungsten-to-copper lamination prepared by brazing.
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