Fabrication of Silver Interdigitated Electrode by a Stamp Method

Kan-Sen Chou,Chia-Hsuan Lee

doi:10.1155/2014/514508

Kan-Sen Chou, Chia-Hsuan Lee

Open Access

https://doi.org/10.1155/2014/514508

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Abstract

A stamp method was developed in this study to fabricate interdigitated electrodes (IDEs) on glass substrate from a 37.5 wt% silver ink. This method is simple and fast. A small amount of silver ink was first dripped into an IDE-patterned sponge of a stamp and then one could stamp out the desired IDE pattern made of nanosized silver colloids on a glass substrate, which was subsequently sintered at 280°C for 10 minutes to obtain the final silver IDE. Our brief study showed that when a large stamping force was used, more ink would be stamped out in the beginning and it decreased after each usage. However, if the force was too small, there would not be sufficient ink for a complete IDE. There existed therefore an optimal force to fabricate IDEs with minimal changes from sample to sample. The average dimension of an IDE when the applied force was 102 gm was roughly 403 ± 20 µm in width and 1154 ± 153 nm in height, and the average final electrical resistivity was about10×10-6 Ω-cm.

Highlights

Interdigitated electrodes (IDEs) are widely used for various sensor applications, such as gas sensor, humidity sensor, biosensor, and so forth [1–10]
The IDE is often chosen as a component for those sensing operation, where electrical signals generated by the sensing material have to be detected via IDEs
In many of these examples, the IDE was fabricated by photolithography in a lift-off process

Summary

Introduction

Interdigitated electrodes (IDEs) are widely used for various sensor applications, such as gas sensor, humidity sensor, biosensor, and so forth [1–10]. Very fine lines, in the range of 250–500 nm in width, can be produced in high density in this manner. The number of fingers can be up to 2000. The width of the digit (finger) is on the order of 3 to 15 μm and the number of fingers is around several hundred for this method. Several different metals had been used for this application, for example, Au, Pt, and Pd-Ag, which were often deposited by sputtering or e-beam evaporation and its thickness is in the range of 30 to 300 nm

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