Fabrication of replica cliché with fine pattern using reverse offset printing process

Abstract

Among the printing processes for printed electronic devices, the gravure offset and reverse offset methods have drawn attention for their fine pattern printing potential. These printing methods use a cliché, which has a decisive effect on the precision and quality of the final product. In this research, a precise cliché replica method is proposed. It consists of copper (Cu) sputtering, precise reverse offset printing with a 5-μm pattern width, nickel‑cobalt (Ni-Co) electroplating, rinsing, etching, and diamond-like carbon (DLC) coating. Cu is deposited on glass by sputtering to a thickness of 3μm. Ni-Co is electroplated to a thickness of 300nm only on the copper and not on the printed pattern. After removing the printed pattern during the rinsing process, Cu is etched through the revealed part resulting from the rinsing process. For the last step of the process, DLC coating is conducted to protect the surface. We finally compare the fabricated replica cliché with the original and print out precise patterns using the replica cliché.