Fabrication of Pt−Si Schottky Diodes Using Soft Lithographic Patterning and Selective Chemical Vapor Deposition

Abstract

Listen

Translate article

This work demonstrates the feasibility of using soft lithographic patterning in conjunction with additive metallization to fabricate micron-scale electronic devices. Specifically, the fabrication of platinum/platinum silicide/silicon Schottky diodes is demonstrated using a unique combination of soft lithographic patterning and additive metallization techniques. The diode architecture provides a useful means through which to demonstrate the specific characteristics and general utility of this fabrication technique. A 30 × 10 array of micron-scale diode features was patterned on a silicon substrate using a polymeric film prepared by micromolding in capillaries (MIMIC), a soft lithographic patterning technique. Following etching to remove oxide from the substrate surface, metallization by selective platinum chemical vapor deposition (CVD) was used to form rectifying contacts to the substrate. The polymeric film successfully served both as an oxide etch resist before metallization and as a deposition-inhibiti...