Fabrication of phthalonitrile-based copper-clad laminates and their application properties: Thermo-stability and dielectric properties

Abstract

Abstract Various phthalonitrile-based resins were prepared and their copper clad laminates were fabricated in this work. The curing behaviors and mechanisms were investigated by Dynamic rheological analysis (DRA) and in-situ FTIR. Results indicated that all phthalonitrile-based resins possessed wide process temperature windows and exhibit good processability. However, phthalonitrile-based resins resulted to various final crosslinking network in the presence of various catalyst/curing agents. Phthalonitrile-based copper clad laminates (CCL) were fabricated with hot-press mold technology. Mechanical properties of the CCL including flexural strength/modulus and peel strength were discussed, accompanied by the investigation of fractural surface of the laminates. Glass transition temperatures of the laminates were studied by both Differential scanning calorimetric (DSC) and Dynamic mechanical analysis (DMA). Then, fractural surface of fiber-reinforced composite laminates was investigated by Scanning electron microscope (SEM) and Micro slicing image (MSI). Results confirmed the satisfactory interfacial adhesion between resin matrices and fibers, which resulted to excellent mechanical properties of composite laminates. Then, dielectric properties of various composite laminates were investigated to evaluate their applications in the field of PCB substrates. Moreover, final dielectric properties of various phthalonitrile-based composites were discussed based on the transformation of molecular structures according to the polymerization mechanisms.