Abstract
In this Letter, the authors demonstrate fabrication of multilevel microstructures using inductively coupled plasma deep reactive ion etcher (ICP-DRIE) in conjunction with dry film photoresist (DFR) as etch mask. By limiting the usage of photoresist on the layers, both the chances of introducing contamination as well as wastage of photoresist are reduced. Thus, combining DFR with DRIE in microfabricating of multilevel microstructure has the potential to significantly reduce fabrication time, cost and contamination.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
