Abstract
We here introduce the dry film photo resist (DFR) used in the UV laser direct image (LDI) photo exposure system. The LDI system has the following advantages: special resist film is not required. The circuit pattern design can be changed easily. It is possible to reduce the manufacturing cost due to mechanization of the exposure process. The quality and the yield obtained by this mechanization can be improved. However, because the laser moves at high speed when DFR is exposed, the amount of the exposure to polymerize must be less than that of the usual method. Therefore, the DFR must have high photosensitivity and this we have developed. This new DFR can be used in the usual process of manufacturing print circuit boards (PCB) as well as other products using DFR in their manufacture. This DFR has been put on the market as UL500. We also introduce the current situation of the printing industry, which is working on the introduction of the LDI system.
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