Fabrication of multi-filler thermoset-based composite bipolar plates for PEMFCs applications: Molding defects and properties characterizations

Abstract

The bipolar plate (BP) material should possess contradictory properties. They should also manufacture from low-cost methods and materials. In the current investigation, thermoset-based composite materials reinforced with conductive fillers, and the compression molding process is implemented. In addition to fabricating the bipolar plates (BPs) with and without the flowing channels, alleviating the defects during the molding process is performed. The channels are perfectly formed on the plates with the designed depth of 0.65 mm and 0.5 mm of width. In the meanwhile, we alleviate different molding defects, which spoil the surface appearance and part properties. Regarding the physical properties, the water contact angle is measured to be around 85°. The through-plane electrical conductivity of molded plates showed high values up to 38 S/cm, and the interfacial contact resistance measured to be 18–24 mΩ cm2. The mean value of the flexural strength of the produced samples was equal to 47 MPa, which is almost twice the DOE target (>25 MPa).